"Effects of different bonding parameters on the electrical performance and ..."

Xu Chen et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.07.115

access: closed

type: Journal Article

metadata version: 2023-09-30

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Xu Chen, Jun Zhang, Chunlei Jiao, Yanmin Liu:
Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. Microelectron. Reliab. 46(5-6): 774-785 (2006)

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