"Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding ..."

Yong Ding, Jang-Kyo Kim (2008)

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DOI: 10.1016/J.MICROREL.2007.01.083

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type: Journal Article

metadata version: 2020-02-22

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Yong Ding, Jang-Kyo Kim:
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise. Microelectron. Reliab. 48(1): 149-157 (2008)

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