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"Electromigration-induced stress in a confined bamboo interconnect with ..."

X. Dong et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.01.002

access: closed

type: Journal Article

metadata version: 2020-10-06

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X. Dong, P. Zhu, Zhonghua Li, Jun Sun, J. D. Boyd:
Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes. Microelectron. Reliab. 50(3): 391-397 (2010)

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