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"Mechanical reliability challenges for MEMS packages: Capping."

Willem D. van Driel et al. (2007)

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DOI: 10.1016/J.MICROREL.2007.07.033

access: closed

type: Journal Article

metadata version: 2020-02-22

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Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang:
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47(9-11): 1823-1826 (2007)

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