"Cu wire bond parameter optimization on various bond pad metallization and ..."

Luke England et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.02.014

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type: Journal Article

metadata version: 2020-02-22

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Luke England, Siew Tze Eng, Chris Liew, Hock Heng Lim:
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes. Microelectron. Reliab. 51(1): 81-87 (2011)

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