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"Analysis of Cu/low-k bond pad delamination by using a novel failure index."
Marcel A. J. van Gils et al. (2007)
- Marcel A. J. van Gils, Olaf van der Sluis
, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47(2-3): 179-186 (2007)
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