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"Interfacial delamination and fatigue life estimation of 3D solder bumps in ..."
Yu Gu, Toshio Nakamura (2004)
- Yu Gu, Toshio Nakamura:
Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages. Microelectron. Reliab. 44(3): 471-483 (2004)
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