"Reliability issues for flip-chip packages."

Paul S. Ho et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.01.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai:
Reliability issues for flip-chip packages. Microelectron. Reliab. 44(5): 719-737 (2004)

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