"3D thermal model to investigate component displacement phenomenon during ..."

Balázs Illés, Gábor Harsányi (2008)

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DOI: 10.1016/J.MICROREL.2008.04.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Balázs Illés, Gábor Harsányi:
3D thermal model to investigate component displacement phenomenon during reflow soldering. Microelectron. Reliab. 48(7): 1062-1068 (2008)

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