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"Experimental studies of board-level reliability of chip-scale packages ..."

Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh (2006)

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DOI: 10.1016/J.MICROREL.2005.07.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh:
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46(2-4): 645-650 (2006)

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