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"Development of the green plastic encapsulation for high density wirebonded ..."

T. Y. Lin et al. (2003)

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DOI: 10.1016/S0026-2714(03)00061-1

access: closed

type: Journal Article

metadata version: 2020-02-22

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T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua:
Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectron. Reliab. 43(5): 811-817 (2003)

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