"Interfacial reaction and mechanical evaluation in multi-level assembly ..."

Hsiu-Min Lin et al. (2015)

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DOI: 10.1016/J.MICROREL.2014.09.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu-Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh:
Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test. Microelectron. Reliab. 55(1): 231-237 (2015)

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