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"The impact of copper contamination on the quality of the second wire ..."
T. Y. Lin et al. (2002)
- T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai:
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectron. Reliab. 42(3): 375-380 (2002)
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