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"Thermally induced deformation of solder joints in real packages: ..."

Hua Lu, Helen Shi, Ming Zhou (2006)

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DOI: 10.1016/J.MICROREL.2005.10.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hua Lu, Helen Shi, Ming Zhou:
Thermally induced deformation of solder joints in real packages: Measurement and analysis. Microelectron. Reliab. 46(7): 1148-1159 (2006)

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