"Effect of the drop impact on BGA/CSP package reliability."

Kinuko Mishiro et al. (2002)

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DOI: 10.1016/S0026-2714(01)00230-X

access: closed

type: Journal Article

metadata version: 2020-02-22

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Kinuko Mishiro, Shigeo Ishikawa, Mitsunori Abe, Toshio Kumai, Yutaka Higashiguchi, Ken-ichiro Tsubone:
Effect of the drop impact on BGA/CSP package reliability. Microelectron. Reliab. 42(1): 77-82 (2002)

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