"The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints."

Van Luong Nguyen, Chin-Sung Chung, Ho-Kyung Kim (2015)

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DOI: 10.1016/J.MICROREL.2015.10.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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Van Luong Nguyen, Chin-Sung Chung, Ho-Kyung Kim:
The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints. Microelectron. Reliab. 55(12): 2808-2816 (2015)

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