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"Wire bond degradation under thermo- and pure mechanical loading."

Kristian Bonderup Pedersen et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.07.055

access: closed

type: Journal Article

metadata version: 2023-09-30

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  - https://dblp.org/rec/journals/mr/PedersenNCKIPP17
Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen:
Wire bond degradation under thermo- and pure mechanical loading. Microelectron. Reliab. 76-77: 373-377 (2017)

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