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"Preliminary failure-mode characterization of emerging direct-lead-bonding ..."

William Sanfins et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.006

access: closed

type: Journal Article

metadata version: 2023-09-30

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William Sanfins, Damien Risaletto, Frédéric Richardeau, G. Blondel, M. Chemin, Philippe Baudesson:
Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection. Microelectron. Reliab. 55(9-10): 1956-1960 (2015)

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