"Adhesion energy of printed circuit board materials using ..."

Ronald Schöngrundner et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.055

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type: Journal Article

metadata version: 2023-09-12

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Ronald Schöngrundner, Megan Jo Cordill, Günther A. Maier, Hans-Peter Gänser:
Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations. Microelectron. Reliab. 55(11): 2382-2390 (2015)

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