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"Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature ..."

Huakai Shao et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.08.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Guisheng Zou, Lei Liu:
Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application. Microelectron. Reliab. 91: 38-45 (2018)

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