"On the difference between thermal cycling and thermal shock testing for ..."

J. W. C. de Vries, M. Y. Jansen, W. D. van Driel (2007)

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DOI: 10.1016/J.MICROREL.2006.05.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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J. W. C. de Vries, M. Y. Jansen, W. D. van Driel:
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. Microelectron. Reliab. 47(2-3): 444-449 (2007)

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