"Reliability of Au bump-Cu direct interconnections fabricated by means of ..."

Qian Wang et al. (2003)

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DOI: 10.1016/S0026-2714(03)00039-8

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type: Journal Article

metadata version: 2023-09-30

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Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga:
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method. Microelectron. Reliab. 43(5): 751-756 (2003)

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