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"SEM in situ study on high cyclic fatigue of SnPb-solder joint in the ..."
Xi-Shu Wang et al. (2011)
- Xi-Shu Wang, Xu-Dong Li, Huai-Hui Ren, Hai-Yan Zhao, Ryosuke Murai:
SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging. Microelectron. Reliab. 51(8): 1377-1384 (2011)
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