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"The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM ..."

C. K. Wong et al. (2008)

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DOI: 10.1016/J.MICROREL.2007.05.002

access: closed

type: Journal Article

metadata version: 2023-09-30

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C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun:
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectron. Reliab. 48(4): 611-621 (2008)

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