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"Investigations of solder joint damage potentials for board-level ..."
Chang-Lin Yeh, Yi-Shao Lai (2008)
- Chang-Lin Yeh, Yi-Shao Lai:
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. Microelectron. Reliab. 48(2): 282-292 (2008)
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