"Reliability analysis of 3D heterogeneous microsystem module by simplified ..."

Meng-Kao Yeh, Chun-Lin Lu (2016)

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DOI: 10.1016/J.MICROREL.2016.06.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Meng-Kao Yeh, Chun-Lin Lu:
Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model. Microelectron. Reliab. 63: 111-119 (2016)

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