"Consideration of temperature and current stress testing on flip chip ..."

Alfred Yeo, Bernd Ebersberger, Charles Lee (2008)

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DOI: 10.1016/J.MICROREL.2008.07.070

access: closed

type: Journal Article

metadata version: 2020-02-22

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Alfred Yeo, Bernd Ebersberger, Charles Lee:
Consideration of temperature and current stress testing on flip chip solder interconnects. Microelectron. Reliab. 48(11-12): 1847-1856 (2008)

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