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"A novel mechanical diced trench structure for warpage reduction in wafer ..."
Chunsheng Zhu et al. (2015)
- Chunsheng Zhu
, Heng Li, Gaowei Xu, Le Luo:
A novel mechanical diced trench structure for warpage reduction in wafer level packaging process. Microelectron. Reliab. 55(2): 418-423 (2015)
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