"Interface Characteristics of Sapphire Direct Bonding for High-Temperature ..."

Wangwang Li et al. (2017)

> Home

Details and statistics

DOI: 10.3390/S17092080

access: open

type: Journal Article

metadata version: 2020-01-12

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/sensors/LiLCJXHLYQL17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/sensors/LiLCJXHLYQL17
Wangwang Li, Ting Liang, Yulei Chen, Pinggang Jia, Jijun Xiong, Ying-ping Hong, Cheng Lei, Zong Yao, Lei Qi, Wenyi Liu:
Interface Characteristics of Sapphire Direct Bonding for High-Temperature Applications. Sensors 17(9): 2080 (2017)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.