"Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a ..."

Dandan Liu et al. (2020)

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DOI: 10.3390/S20041186

access: open

type: Journal Article

metadata version: 2022-02-01

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Dandan Liu, Huafeng Liu, Jin Quan Liu, Fangjing Hu, Ji Fan, Wen-Jie Wu, Liang Cheng Tu:
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer. Sensors 20(4): 1186 (2020)

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