"Application of Through Glass Via (TGV) Technology for Sensors ..."

Chen Yu et al. (2024)

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DOI: 10.3390/S24010171

access: open

type: Journal Article

metadata version: 2024-01-26

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Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu:
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging. Sensors 24(1): 171 (2024)

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