"A Novel End-to-End Deep Learning Framework for Chip Packaging Defect ..."

Siyi Zhou et al. (2024)

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DOI: 10.3390/S24175837

access: open

type: Journal Article

metadata version: 2024-10-03

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Siyi Zhou, Shunhua Yao, Tao Shen, Qingwang Wang:
A Novel End-to-End Deep Learning Framework for Chip Packaging Defect Detection. Sensors 24(17): 5837 (2024)

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