"Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs."

Pooria M. Yaghini et al. (2016)

> Home

Details and statistics

DOI: 10.1109/TC.2015.2498550

access: closed

type: Journal Article

metadata version: 2020-06-15

- view
  authority control:
- export record
  dblp key:
  - journals/tc/YaghiniEYBG16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tc/YaghiniEYBG16
Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, Nader Bagherzadeh, Michael M. Green:
Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs. IEEE Trans. Computers 65(3): 693-705 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.