"Robust Simulation Methodology for Surface-Roughness Loss in Interconnect ..."

Quan Chen, Hoi Wai Choi, Ngai Wong (2009)

> Home

Details and statistics

DOI: 10.1109/TCAD.2009.2030408

access: closed

type: Journal Article

metadata version: 2025-08-19

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/ChenCW09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/ChenCW09
Quan Chen, Hoi Wai Choi, Ngai Wong:
Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 28(11): 1654-1665 (2009)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.