"Interconnect layout optimization under higher order RLC model forMCM designs."

Jason Cong, Cheng-Kok Koh, Patrick H. Madden (2001)

> Home

Details and statistics

DOI: 10.1109/43.969438

access: closed

type: Journal Article

metadata version: 2020-09-24

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/CongKM01
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/CongKM01
Jason Cong, Cheng-Kok Koh, Patrick H. Madden:
Interconnect layout optimization under higher order RLC model forMCM designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 20(12): 1455-1463 (2001)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.