"HotCluster: A Thermal-Aware Defect Recovery Method for ..."

Khanh N. Dang et al. (2022)

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DOI: 10.1109/TCAD.2021.3069370

access: closed

type: Journal Article

metadata version: 2022-04-01

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Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(4): 799-812 (2022)

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