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"Verification and Codesign of the Package and Die Power Delivery System ..."

Imad A. Ferzli, Eli Chiprout, Farid N. Najm (2010)

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DOI: 10.1109/TCAD.2009.2034563

access: closed

type: Journal Article

metadata version: 2020-09-24

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Imad A. Ferzli, Eli Chiprout, Farid N. Najm:
Verification and Codesign of the Package and Die Power Delivery System Using Wavelets. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 29(1): 92-102 (2010)

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