![](https://dblp.dagstuhl.de/img/logo.ua.320x120.png)
![](https://dblp.dagstuhl.de/img/dropdown.dark.16x16.png)
![](https://dblp.dagstuhl.de/img/peace.dark.16x16.png)
Остановите войну!
for scientists:
![search dblp search dblp](https://dblp.dagstuhl.de/img/search.dark.16x16.png)
![search dblp](https://dblp.dagstuhl.de/img/search.dark.16x16.png)
default search action
"Built-In Self-Repair Scheme for the TSVs in 3-D ICs."
Yu-Jen Huang, Jin-Fu Li (2012)
- Yu-Jen Huang, Jin-Fu Li:
Built-In Self-Repair Scheme for the TSVs in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(10): 1600-1613 (2012)
![](https://dblp.dagstuhl.de/img/cog.dark.24x24.png)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.