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"Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing."

Nabeeh Kandalaft, Rashid Rashidzadeh, Majid Ahmadi (2013)

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DOI: 10.1109/TCAD.2012.2237226

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - journals/tcad/KandalaftRA13
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  - https://dblp.org/rec/journals/tcad/KandalaftRA13
Nabeeh Kandalaft, Rashid Rashidzadeh, Majid Ahmadi:
Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(4): 538-546 (2013)

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