"Compact Lateral Thermal Resistance Model of TSVs for Fast ..."

Zao Liu et al. (2014)

> Home

Details and statistics

DOI: 10.1109/TCAD.2014.2334321

access: closed

type: Journal Article

metadata version: 2020-09-24

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/LiuSTCW14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/LiuSTCW14
Zao Liu, Sahana Swarup, Sheldon X.-D. Tan, Hai-Bao Chen, Hai Wang:
Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(10): 1490-1502 (2014)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.