"Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV ..."

Yarui Peng et al. (2014)

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DOI: 10.1109/TCAD.2014.2359578

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type: Journal Article

metadata version: 2022-10-02

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Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim:
Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(12): 1900-1913 (2014)

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