"Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor ..."

Umamaheswara Rao Tida et al. (2020)

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DOI: 10.1109/TCAD.2018.2887053

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type: Journal Article

metadata version: 2025-01-19

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Umamaheswara Rao Tida, Cheng Zhuo, Leibo Liu, Yiyu Shi:
Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(2): 281-293 (2020)

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