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"Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs."

Ran Wang, Krishnendu Chakrabarty, Bill Eklow (2014)

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DOI: 10.1109/TCAD.2014.2331336

access: closed

type: Journal Article

metadata version: 2022-01-03

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Ran Wang, Krishnendu Chakrabarty, Bill Eklow:
Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(9): 1410-1423 (2014)

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