"Analytical Framework to Model Reconfigurable Metasurfaces Including Lumped ..."

Mario Perez-Escribano et al. (2024)

> Home

Details and statistics

DOI: 10.1109/TCSII.2023.3330318

access: closed

type: Journal Article

metadata version: 2024-04-15

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcasII/PerezEscribanoMMVPA24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcasII/PerezEscribanoMMVPA24
Mario Perez-Escribano, Salvador Moreno-Rodríguez, Carlos Molero, Juan F. Valenzuela-Valdés, Pablo Padilla, Antonio Alex-Amor:
Analytical Framework to Model Reconfigurable Metasurfaces Including Lumped Elements. IEEE Trans. Circuits Syst. II Express Briefs 71(4): 1784-1788 (2024)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.