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"A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using ..."

Tianming Ni et al. (2021)

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DOI: 10.1109/TETC.2020.2969237

access: closed

type: Journal Article

metadata version: 2023-10-28

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Tianming Ni, Zhao Yang, Hao Chang, Xiaoqiang Zhang, Lin Lu, Aibin Yan, Zhengfeng Huang, Xiaoqing Wen:
A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology. IEEE Trans. Emerg. Top. Comput. 9(2): 724-734 (2021)

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