"A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging ..."

Lanyu Zhang et al. (2021)

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DOI: 10.1109/TIE.2020.3020018

access: closed

type: Journal Article

metadata version: 2023-09-30

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Lanyu Zhang, Jian Gao, Yunbo He, Xin Chen, Yun Chen, Hui Tang, Zhijun Yang:
A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process. IEEE Trans. Ind. Electron. 68(8): 7252-7262 (2021)

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