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"A Multiparameter Numerical Modeling and Simulation of the Dipping Process ..."
Junhui Li et al. (2019)
- Junhui Li
, Haoliang Zhang, Can Zhou
, Zhuo Chen
, Xinxin Chen, Zhili Long, Xiaohe Liu, Wenhui Zhu
:
A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging. IEEE Trans. Ind. Informatics 15(7): 3808-3820 (2019)
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