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"Contactless Test Access Mechanism for TSV-Based 3-D ICs Utilizing ..."

Iftekhar Ibne Basith, Rashid Rashidzadeh (2016)

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DOI: 10.1109/TIM.2015.2477240

access: closed

type: Journal Article

metadata version: 2020-06-08

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Iftekhar Ibne Basith, Rashid Rashidzadeh:
Contactless Test Access Mechanism for TSV-Based 3-D ICs Utilizing Capacitive Coupling. IEEE Trans. Instrum. Meas. 65(1): 88-95 (2016)

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