"In Situ Monitoring Bonding Wires Fatigue in IGBT Power Modules Using ..."

Mingxing Du et al. (2025)

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DOI: 10.1109/TIM.2025.3551980

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type: Journal Article

metadata version: 2025-05-09

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Mingxing Du, Shaoxiang Wang, Jianxiong Yang, Jinliang Yin:
In Situ Monitoring Bonding Wires Fatigue in IGBT Power Modules Using Differential Mode Impedance Extracted From Dual Current Probe Technology. IEEE Trans. Instrum. Meas. 74: 1-11 (2025)

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