"Design, Test, and Evaluation of a Novel Die-Attach Structure for Packaging ..."

Yukun Ma et al. (2024)

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DOI: 10.1109/TIM.2024.3470046

access: closed

type: Journal Article

metadata version: 2024-11-06

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Yukun Ma, Haonan Li, Yonggang Yin, Rong Zhang, Fengtian Han:
Design, Test, and Evaluation of a Novel Die-Attach Structure for Packaging Stress Suppression of MEMS Resonant Accelerometers. IEEE Trans. Instrum. Meas. 73: 1-10 (2024)

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